Equipment

Chip Die Bonder

Helios NanoLab DualBeam System

ECR-RIE System

ICP-RIE System

Leybold L560

Molecular Beam Epitaxy (MBE) System

Reactive Ion Etch System

Hitachi S-900 SEM

Hitachi S-4100 SEM

Secondary Ion Mass Spectrometry (SIMS) System

FEI Titan 80-300 TEM

BesTec UHV Sputtering System

 

Kulicke & Soffa Manual Wire Bonder