Equipment
Chip Die Bonder
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Helios NanoLab DualBeam System
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ECR-RIE System
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ICP-RIE System
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Leybold L560
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Molecular Beam Epitaxy (MBE) System
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Reactive Ion Etch System
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Hitachi S-900 SEM
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Hitachi S-4100 SEM
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Secondary Ion Mass Spectrometry (SIMS) System
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FEI Titan 80-300 TEM
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BesTec UHV Sputtering System
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Kulicke & Soffa Manual Wire Bonder
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